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Phoenix Contact Leiterplattensteckverbinder Grundleiste MCDV 1,5 14 GF 3,81 f. Leiterplattenst. − 50 Stück Mitsubishi Heavy mit 3 Innengeräte Anwenderinformationen und Designempfehlungen zur Through Anwenderinformationen und Designempfehlungen zur Through Hole Reflow Technologie finden Sie unter: Downloads Typ: CMP 757 D M1 4 Anzahl der Potenziale: 28 Pin Layout: Lineares Pinning
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