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Phoenix Contact Leiterplattensteckverbinder Grundleiste DFK PC 4 11 #1861248 f. Leiterplattenst. − 50 Stück VRF VRV Systeme 3D Airflow Technologie 3D Airflow Technologie Hitzstabilisierte Kabelbinder (PA66HS) für Temperaturen bis +105 °C Anzahl der Potenziale: 11 Montage: Direktmontage
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