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Placa PEI Texturizada Bambu Lab Para Series A1, P1, P2, X1 y X2 H2D PRO Placa electrónica de conexión de Placa electrónica de conexión de extrusor para P1S y P1P PLA PLA CF PLA GF 45~60℃ PLA PLA CF PLA GF 45~60 °C No PETG PETG CF 60~80℃ PETG PETG CF 60~80 °C Barra de pegamento Pegamento líquido ABS 90~100℃ ABS (no para A1 mini) 90~100 °C Barra de pegamento Pegamento líquido ASA 90~100℃ ASA (no para A1 mini) 90~100 °C Barra de pegamento Pegamento líquido TPU 35~45℃ TPU 35~45 °C Barra de pegamento Pegamento líquido PVA 45~60℃ PVA 45~60 °C Barra de pegamento Pegamento líquido PC PC CF 90~110℃ PC PC CF (no para A1 mini) 90~110 °C Barra de pegamento PA PA CF PAHT CF 90~110℃ PA PA CF PAHT CF (no para A1 mini) 90~110 °C Barra de pegamento PET CF 80~100℃ PET CF (no para A1 mini) 80~100 °C Barra de pegamento Pegamento líquido Bambu Lab X1E Bambu Lab P1P
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